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倒装焊接机 & 混合贴装设备[通用型倒装焊接机、芯片焊接机] i-CubeII
Date:2020-11-20 Hits:781
可混装SMD元件和半导体元件 对应多元件供给 对应浸渍、压印的转印装置 对应涂抹 可对应广范围L300mm×W200mm
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